The Fibocom 5G Sub-6 Module FG160 is a high-performance series of 5G wireless communication modules designed for Fixed Wireless Access (FWA), IoT gateways, industrial monitoring, and high-speed data terminals.
Key Specifications
* Chipset: Powered by the Qualcomm Snapdragon X62 modem chipset
* Standard: Compliant with 3GPP Release 16 and NR Carrier Aggregation (CA)
* Air Interface: 5G Sub-6 GHz (backward compatible with LTE-FDD, LTE-TDD, and WCDMA)
* Form Factor: LGA package measuring 41.0 x 44.0 x 2.75 mm (pin-compatible with Fibocom's FG150 module)
* Max Speeds:
* 5G SA downlink up to 2470 Mbps / uplink up to 900 Mbps
* 5G ENDC downlink up to 3470 Mbps / uplink up to 555 Mbps
* LTE downlink up to 1600 Mbps / uplink up to 211 Mbps
* Operating Temperature: -30°C to +75°C
* Features: Supports OpenCPU (enabling 160MHz bandwidth, 4096 QAM, and Wi-Fi 6E), multi-constellation GNSS (GPS, GLONASS, Galileo, BeiDou, QZSS), and various interfaces including USB 3.1/3.0, PCIe 4.0/3.0, and USIM.
* Regional Variants: Available in versions such as -EAU (Asia/Europe/Australia/Brazil), -NA (North America), and -IN (India).
.jpeg)
